Use the RoHS/LF P/N Search to find FCI Leadfree parts
Tin whiskers are a physical phenomena that can occur with “pure?_ tin plating. One of the primary reasons that lead had for decades been added to tin plating and solders in the electronics industry was to reduce the likelihood of tin whisker growth. This is an industry-wide issue not restricted to FCI or its products. FCI has for several years conducted extensive testing of tin plating chemistries and various techniques to reduce to likelihood of whisker formation. In addition, we participate in industry forums and standards organizations, such as iNEMI and IEC, where whisker test specifications continue to be developed. These industry test methods along with additional test methods developed internally at FCI were used to qualify FCI tin plating processes and those used by our suppliers.
FCI employs industry recognized whisker mitigation practices. However, for certain applications where any possible whisker formation must be avoided, FCI recommends alternative lead-free finishes, such as gold or GXT® (gold-flash over palladium-nickel alloy) plating, which have no possibility of whisker formation.
