High density, high speed, discrete contact, array connector - Flexible ground distribution optimizes high speed signal integrity - 10Gb/s differential pair performance with under 1% cross-talk - 28 Gb/s high speed performance documented for 4mm stack height per OIF short reach specification CEI-28G-SR - Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market - 1.27mm x 1.27mm grid provides 71 contacts per cm2 density to save space
Wide range of sizes and PCB stack heights increase mechanical design flexibility - 7 sizes: 81 to 528 positions - 6 PCB Stack heights: 4mm low profile to 14mm
Revolutionary, trusted BGA interconnect platform - High density standard BGA attachment lowers assembly costs by using standard SMT processes - BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
BGA Quality and Reliability-Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options - 22+ year solder joint reliability per IPC-SM-785 - 17 Billion + lines shipped to customer satisfaction - Precious metal plating options satisfy varying customer needs for environmental resistance
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