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> Back To Electronics Overview       White Papers and Presentation   DesignCon 2007 to 2011   Component Performance Required To Ensure 25 Gb/s Link Operation   Compliance Testing of Passive Interconnects   Required Technologies for Transmission of 4 x 25 Gb/s Over a Copper Backplane   Comparison of S-Parameter Concatenation to Full-Wave Simulation for High-Speed Interconnect Analysis   Feasibility of 25 Gb/s Serial Transmission Over Copper Cable Assemblies   Improving System Performance by Reducing System Impedance to 85 Ohms   DesignCon 2007 Presentation   Steckerverbinderkongress, Würzburg 2010 and 2011   100Gbits/s I/O - Challenges for connectors (2010)   Entwicklungstrends bei Leistungssteckverbinder (2011) German version   Power Connector Trends (2011) English version   Others   Optimizing & extending the reach of high speed copper cable assemblies   AirMax VS reg connector system – the secret of minimizing crosstalk without costly shields   FCI and partners   Scalability of Duobinary Signaling of 25 Gb/s for 100GbE Applications - Bell Labs, Lucent Technologies   A 40 Gb/s Backplane Reference Design - ACCELERANT NETWORK   A Next Generation Backplane Design - Endicott Interconnect   AirMax VS® at 2.5 Gb/s - Marvell   10 Gb/s using AirMax VS® and MAX 3850 - Maxim   A10 Gb/s Demonstration System - Mitsubishi Electric   10 Gb/s with Equalized Connectors - Thin Film Technology Corporation   Custom AirMax VS® @ATCA Backplane - Sanmina-SCI   10 Gb/s NRZ Demonstrator Backplane -Xilinx   10 Gb/s NRZ Demonstrator Backplane- Northrop Grumman Interconnect Technologies   Airmax VS® 2mm 4 Pair I/O Demonstrator - FCI & GORE