HCI^® High Power Connectors are Hard Metric-compliant and are a perfect complement to FCI‘s high-performance AirMax VS^® and ZipLine^® signal connector systems as well as Millipacs^® 2mm connectors. These high current density power connectors mount alongside their signal counterparts and are used in applications where bulk current must pass through a backplane or midplane to power consuming components on a mating daughter card (blades, controller boards, line cards, etc).

The power contacts incorporate multiple points of contact and are made using a high conductivity copper alloy. In addition, the unique housing design includes openings that allow air to flow through the mated connectors thus enhancing heat dissipation properties. These design features enable the connector system‘s very high current-carrying capability.

HCI High Power Connectors are available in compact two- or three-position power modules and leverage existing HCI power contact technology. In addition to the conventional 1x2 and 1x3 power contact configurations, a two-position module is available with an integrated guide between the two power contacts. The power contacts are capable of carrying 75 amps per contact without exceeding a 30°C temperature rise in still air. Please reference current rating information in the HCI Product Specification (GS-12-380) for additional details.

Individual power contacts are surrounded on four sides by molded housing walls to ensure that adjacent power contacts cannot short together. In addition, the protected backplane/midplane receptacles are UL 60950 compliant (Test Finger and Test Probe).