FlexILVIA project started in July 2007 and is supported by Eureka Cluster Euripides. The Consortium represents a good construction to respond to each step of the value chain and comprises a partner addressing each technology block and business development: FCI, Datacon, Meco, AT4 wireless, and Paragon Identification

FCI Corporate Research Center teams have been designated as project coordinators to develop flexible RFID inlays and associated reel-to-reel processes compatible with a high volume production. The RFID inlays are made of flexible substrates on which small silicon chips are assembled by flip-chip.

The project aims at designing, manufacturing and packaging flexible antennae to be used in contactless object identification and tracking systems exploiting radio frequency identification technologies at short to medium distances.

The FlexILVIA project is intended to have a significant impact in pushing the expansion of RFID applications and the technology step of the replacement of traditional logistic barcodes by electronic tags in the few years to come.

The FlexILVIA project is a combination of radio waves-based technology and microchip technology and will therefore assemble small silicon processors on antennae substrates that will be integrated into labels for use. The goal of the project is to find the proper reel-to-reel mass-production processes suitable in making antennae on flexible substrates and assembling the chips on them with both increased yield, throughput, reliability, and high volume while being low cost. The technology blocks addressed by the project include the antennae substrates, the chip bonding, the inlay conversion and the testing. In terms of operating frequencies, both HF and UHF bands are concerned in FlexILVIA.