Memory module sockets from FCI are designed to accept most industry standard memory types (DDR, DDR2, DDR3) and form factors such as DIMM or VLP DIMM. The sockets allow convenient memory expansion in servers and embedded applications in communications, data and industrial equipment.DDR3 memory sockets from FCI are available in various form factors including VLP (very low profile) providing an overall connector height of less than 20.6 mm and comply to JEDEC SO-007 specifications.
Connectors provide mechanical voltage keying and end latches for module retention and ejection.
DIMM connectors feature a low insertion-force socket design that requires less than 24 pounds force for module installation.
Available solder tail options for vertical DDR3 connectors support use on 1.58mm (.062”) or 2.36mm(.093”) thick motherboards, while press-fit options extend use to thicker motherboards.
Contact design protects against stubbing and supports high-speed serial differential signaling at data rates extending to 4.8 Gb/s for DDR3.
RoHS-Compliant and “Lead-free” process-compatible options are available to aid compliance with lead elimination initiatives.
Low Level Contact Resistance (LLCR) featured on DDR3 sockets accept RDIMM DDR3 modules (Registered DIMM).
Very Low Profile (VLP) form factors provide connector heights of less than 21 mm above the board, while accepting modules with a seating height of less than 2.4 mm.
Slim latch - and connector body- designs facilitate optimized airflow
