FCI ’s XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. The use of engineering polymers in a resonance-damping shield enables very low crosstalk across a wide frequency range.

XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card, providing up to 82.4 differential pairs/inch. A wafer organizer can be used to combine groups of right-angle signal, guidance and power modules as an integrated daughter-card connector.