HighSpeedBackpanelAirmaxOhms

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Product Overview	Co-Planar	New Developments
Backpanel	High Speed I/O	White Papers
Orthogonal	Mezzanine

Airmax VS® 85 Ohms

FCI together with Intel^® jointly developed the Airmax VS^® 85 Ohm Connector platform for Quick Path Interconnect QPI^® which links between processors or processors and I/O controllers . It is envisioned that current storage and server systems designed around the 100 Ohm platform will eventually migrate to 85 Ohm in the future. Matching impedances throughout the channel will help maximize signal throughput. FCI is proud to be the first to participate in this technology.

For more information please contact: airmax@fci.com

Useful Links
	Datasheet
	AirMax VS^® and ZipLine^™ High Speed Connector Systems
Specifications
	Product Specification Signal connectors
	Application Specification Signal connectors
White Papers
	Improving System Performance by Reducing System Impedance to 85 Ohms
	DesignCon 2007 Presentation
	Comparison of S-Parameter Concatenation to Full-Wave Simulation for High-Speed Interconnect Analysis
Accessory Modules
	AirMax VS^® Guidance system_product application-customer
	AirMax VS^® Back Panel Power system_product application
Markets & Applications
	Data
	Communications
	Industrial, Instrumentation & Medical

Airmax VS^® 85Ohms Backpanel P/N

Hard Metric High Power

P/N Airmax VS^® Accessories

Features & Benefits
	Tested and fully compliant with Intel^® QPI connector specifications.
	Support increased QPI link speeds of 6,4 Gb/s and >8 Gb/s.
	Right-angle and vertical receptacles and headers support backplane and coplanar connections.
	Backwards-compatibility to 100Ω mating interfaces provides a smooth transition to new designs.
	Available with 2mm or 3mm column spacing.
	Complementary power connectors and guide modules complete range.
	Compatible with Hard Metric design practice.
	Halogen-free products aid efforts to minimize the use of environmentally sensitive materials in the electronics industry.

Electrical Performance
	Average Differential Impedance: 85 Ω +/- 5 Ωs @ 50ps (10-90%) risetime
	Insertion Loss: <1.5dB through 8Gbps
	Worst-case Multi-active Near-end Crosstalk:
	< -30dB through 8Gbps
	Worst-case Multi-active Far-end Crosstalk:
	< -30dB through 8Gbps
	* Intel Corporate Website