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Product Type Power Connectors µTCA® Power IO
Standard density High Performance Economy Range
High density Press Fit Accessories
Cable Connectors Pin-in-Paste Order Samples
 
 
 
D-Sub Pin-in-Paste
 

Pin-in-paste technology (PIP) allows the use of Through hole product in SMT manufacturing process. The connectors are automatically or manually placed on board, and then soldered in the same operation as the SMT components. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic material, metal peg, housing design, pin length and packaging.
 
Useful Links
Customer Product Presentations
D-Sub General Presentation
Application Overview
D-Sub Pin in Paste Presentation
Pin in Paste Technology & Products
 
Product Information Sheets
D-Sub Pin-in-Paste Connectors
Pin-in-Paste Application Guide
D-Sub Connectors & Accessories
D-Sub connector Solutions
Connector Overview
Connectors for Process Control
Product Portfolio Introduction
D-Subminiature Product Finder
 
Markets & Applications
Communications market
Data market
Consumer market
Industrial, Instrumentation & Medical market
 
  
 
Features & Benefits
 
Through hole technology compatible to Reflow process - an innovative solution for savings on the total applied costs
Allow customers to reduce their total applied costs by replacing wave soldering process or costlier pressfit option
No PCB layout redesign is required to shift to Pin in paste from STB or Press fit process
Can be automatically positioned on the board using automatic pick and place processes and thus saves time
Ideal for applications such as daughter boards in industrial and telecom applications
More stable process than wave soldering as it does not need constant adjust once set-up.
Less control time after reflow process and less re-work time for repairing
RoHS compliant
 
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