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 Airmax VS®
 
 
 Introduction to Airmax VS   85 Ohms connectors
 Features & Benefits  P/Ns & Selection guide
 Specifications and test reports  References
 Design pack & Datasheets  Nomenclature
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85 Ohms connectors

At DesignCon in 2007, FCI and Intel presented a joint paper titled “Improving System Performance by Reducing System Impedance to 85 Ohms.”  FCI has developed several backpanel connectors in support of the Intel 85 ohm system platform.

QPI Connector development

        
Useful Links
 
Datasheets
10080879 - 5-Pair 10 IMLA Vertical Header PF 3mm
10080577 - 5-Pair 10 IMLA Right Angle Header PF 3mm
100808785 - Pair 10 IMLA Right Angle Receptacle PF 3mm
 
Guide Modules
AirmMax VS Backpanel Power system product application
Airmax VS Guidance system product application customer
Airmax VS Guidance system product application internal
 
DesignCon 2007
Comparison of S-Parameter Concatenation to Full-Wave Simulation for High-Speed Interconnect Analysis
Improving System Performance by Reducing System Impedance to 85 Ohms (PDF format) - (PPT presentation)
 
 
 Features & Benefits

Reduced impedance discontinuities
- 85 ohm via holes are easier to design than 100 ohm via holes
- Reduced impedance mismatch
- improved smoothness of insertion loss curve
Reduced PCB thickness/cost
Less PCB material required, lower cost
Increased routing density using 0.2mm traces
Increased routing density w/same trace width

Electrical Performance

Differential Impedance: 85 +/- 8 ohms at 35ps (20-80%) / 50ps (10-90%)
Differential Insertion Loss:
- < 1dB through 6Gbps (3GHz)
- < 3dB through 20Gbps (10GHz)
Multi-active NEXT: < 3.25% at 35ps (20-80%) / 50ps (10-90%)
Multi-active FEXT: < 5% at 35ps (20-80%) / 50ps (10-90%)
In-pair Skew: < 12ps